Kick-Off Meeting on March 13th, 2018
On March 13th, 2018, the Supersmart consortium launched the project in a Kick-Off Meeting. The meeting took place in Munich and went along with the Lope-C 2018 conference. The Supersmart members committed themselves to upscale technologies and material syntheses for printed electronics in order to pave the way for commercialization. This will boost the European competitive position and increase the maturity of technological solutions for ubiquitous electronics.