Digitalization, “Internet of things”, and “Industry 4.0” demand for ubiquitous sensing and communication elements. Printed electronic components allow one to reduce the cost per function and to process components in High-Throughput production schemes. The goal of SUPERSMART project is the industrialization of high-performance key materials in order to secure the electronic material supply chain. Taking environmental impact into consideration materials selected to be industrialized exchange toxic and rare inorganic material by organic materials and use paper substrates instead of plastics. By this approach, recyclability will be simplified.
For industrialization of materials, synthesis procedures of successfully tested materials will be up-scaled. The performance of up-scaled materials is proven by technical demonstrators produced by using high-throughput manufacturing methods such as R2R techniques.
SUPERSMART focuses on industrialization of materials and their processing for
- Paper-based printed circuit board approaches with integrated electrochromic layers and impedance matching electronics.
- Electronics based on printable metal oxide semiconductors
- Pressure sensor arrays
- Near-field communication devices
- Paper-based barrier films
Beside of the performance of the up-scaled materials, main focus is on recyclability and life cycle analysis of materials.