Supersmart Project

Digitalization, “Internet of things”, and “Industry 4.0” demand for ubiquitous sensing and communication elements. Printed electronic components allow one to reduce the cost per function and to process components in High-Throughput production schemes. The goal of SUPERSMART project is the industrialization of high-performance key materials in order to secure the electronic material supply chain.

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This activity has received funding from the European Institute of Innovation and Technology (EIT). This body of the European Union receives support from the European Union's Horizon 2020 research and innovation programme.


Kick-Off Meeting on March 13th, 2018

On March 13th, 2018, the Supersmart consortium launched the project in a Kick-Off Meeting. The meeting took place in Munich.